41 lines
868 B
Makefile
41 lines
868 B
Makefile
# STM8S003F3P6TR 固件第一阶段构建文件。
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# 本阶段只验证工程结构和模块接口，硬件寄存器驱动将在后续阶段逐步接入。
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PROJECT := mesh_relay
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BUILD_DIR := build
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SRC_DIR := src
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INC_DIR := include
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CC := sdcc
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OBJCOPY := packihx
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CFLAGS := -mstm8 --std-c99 --opt-code-size -I$(INC_DIR)
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LDFLAGS := -mstm8 --out-fmt-ihx
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SOURCES := $(shell find $(SRC_DIR) -name '*.c' -print)
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OBJECTS := $(patsubst $(SRC_DIR)/%.c,$(BUILD_DIR)/%.rel,$(SOURCES))
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IHX := $(BUILD_DIR)/$(PROJECT).ihx
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HEX := $(BUILD_DIR)/$(PROJECT).hex
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.PHONY: all clean size
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all: $(HEX)
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$(HEX): $(IHX)
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@mkdir -p $(dir $@)
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$(OBJCOPY) $< > $@
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$(IHX): $(OBJECTS)
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@mkdir -p $(dir $@)
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$(CC) $(LDFLAGS) -o $@ $(OBJECTS)
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$(BUILD_DIR)/%.rel: $(SRC_DIR)/%.c
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@mkdir -p $(dir $@)
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$(CC) $(CFLAGS) -c $< -o $@
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size: $(IHX)
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@ls -lh $(IHX) $(HEX)
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clean:
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rm -rf $(BUILD_DIR)
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